The AI Chip for Security is a highly integrated, low-power RISC-V–based AI SoC designed for intelligent security and edge vision applications. It combines AI acceleration, video processing, audio processing, and hardware-level security in a compact package, delivering high performance, ultra-low power consumption, and flexible system integration for OEM/ODM deployments. It powering everything from Smart City infrastructure and IoT security to Embodied AI and autonomous robotics.
1. Integrated AI SoC Architecture
This AI security chip integrates CPU, video, audio, security, and AI subsystems into a single SoC. Its multi-core heterogeneous architecture supports parallel task execution and intelligent resource scheduling, enabling efficient edge AI processing.
2. High Performance with Ultra-Low Power
Featuring a dedicated AI accelerator delivering up to 0.6 TOPS, the chip achieves 300% higher computing efficiency while maintaining ultra-low power consumption. Peak current remains below 45 mA, with deep sleep power as low as <10 μA, making it ideal for always-on security devices.
3. Built for Harsh Environments
Designed for industrial and outdoor security applications, the chip operates reliably from -40°C to 85°C, with junction temperatures up to 125°C, high ESD protection, and strong latch-up immunity.
4. Flexible Interfaces & Customization
Rich interfaces including MIPI-CSI, HDMI, USB 3.0, and Ethernet enable easy connection to cameras and peripherals. Configurable hardware acceleration modules support OEM/ODM customization for diverse security solutions.
| AI Performance | 0.6 TOPS AI accelerator |
| Process Technology | 55nm low-power process (1P7M) |
| Package | QFN40L, 5 × 5 × 0.75 mm |
| Power Supply | Single 3.3V input with integrated LDOs (1.2V / 1.8V) |
| Power Consumption | Peak: <45 mA @ 25°C Deep Sleep: <10 μA |
| Operating Conditions | Ambient Temperature: -40℃ to 85℃ Junction Temperature: -40℃ to 125℃ ESD Protection: 4 kV (HBM) T.B.D (CDM) Latch-up Immunity: 200mA |
| Applications | Smart security, smart traffic, industrial vision, smart home |
Our high-performance AI SoC chip series provides the core intelligence for the next generation of smart devices, spanning three strategic domains:
1. "Video Surveillance + AI" Ecosystem
Empowering large-scale infrastructure with real-time edge computing and intelligent analytics.
2. Vision-Based Smart Connected Devices
Driving the evolution of the Internet of Things (IoT) through advanced visual processing and seamless connectivity.
3. Integrated Fusion-Sensing Agents
The brain behind autonomous machines, combining multi-sensor fusion with sophisticated AI inference.
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